Optical Sciences

Biomolecules and nanostructures

The Optical Sciences group studies the interaction of light and matter at the nanoscale. We do this by exploring ways to shape light and its environment. It's what we call active and passive control. Our current focus is on the interaction of light with biomolecules and nanostructures. We are part of Twente University's Department of Science and Technology and member of the MESA+ institute.
We participate in the EU-COST actions MP1102: Coherent Raman microscopy (MicroCor) and CM1202: Supramolecular photocatalytic water splitting (PERSPECT-H2O)


Design and fabrication of 3D waveguide couplers

  • Jinfeng Mu - PhD student
  • Sonia GarcĂ­a Blanco - Scientific Staff
  • Mustafa Akin Sefunc - Former member

  • Connectivity between different photonic chips and between different levels within the same chip are currently a bottleneck in highly integrated photonic systems. Connection between electronic chips is realized by means of electrical cables, typically in the form of wirebonds, which have reached very high levels of complexity [Fig. 1 (a)]. However, the ultrahigh bit rates (>Tbps) that need to be transmitted in a single wire in the case of photonic circuits falls beyond the limit of typical electrical interconnections. Photonic wirebonds have been recently proposed as photonic counterparts to the metallic wirebonds [Fig. 1 (b)]. This MSc project aims to develop a technology to design and fabricate "generic" adiabatic waveguide couplers for flip-chip applications. The PhoeniX software and Nanoscribe Direct Laser Writing (DLW) 3D laser lithography system are proposed to do the design and fabrication work. The project is embedded within the STW-HTSM project "High bit rate on-chip nanoamplifiers in Er3+ doped double tungstate", and will be supported by several OS members as well as several industrial partners (i.e., TE Connectivity, LioniX, PhoeniX, TNO and IBM).

    Multi-IC stack connected by metallic wirebonds   Multi-IC stack connected by metallic wirebonds
    Fig. 1. (a) Multi-IC stack connected by metallic wirebonds [1]; (b) Photonic wirebond connecting two photonic chips with silicon-on-insulator (SOI) waveguides [2].


    [1] Nanoscribe GmbH: True 3D Laser Lithography, (http://www.nanoscribe.de)
    [2] http://flipchips.com/tutorial/assembly/nailing-ics-together/
    [3] N. Lindenmann, et. al., "Photonic wire bonding: a novel concept for chipscale interconnects" Opt. Express, 20, 17667-17677 (2012).

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